| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| OMAPL138EZWTA3 | IC |
TI/德州仪器 |
25+ |
1000 |
||||
| 74HC14BQ-Q100 | IC |
NEXPERIA/安世 |
1100 |
|||||
| GD25Q256EYIGR | IC |
GD/兆易创新 |
21+ |
4000 |
||||
| W29N01HVSINA | IC |
WINBOND/华邦 |
24+ |
2000 |
||||
| AT32F415RBT7 | IC |
ARTERY/雅特力 |
21+ |
4000 |
||||
| SN74LV138APWR | IC |
TI/德州仪器 |
24+ |
10000 |
||||
| CC1206KKX7R6BB226 | IC |
YAGEO/国巨 |
1000 |
|||||
| NSI1312S-DSWVR | IC |
NOVOSENSE/纳芯微 |
25+ |
1000 |
||||
| XT26G02CWSIG | IC |
XTX/芯天下 |
22+ |
1000 |
||||
| HC32F460JETA | IC |
HDSC/华大半导体 |
23+ |
4000 |
||||
| XT26G02ELGIGA | 存储IC |
XTX/芯天下 |
LGA-8(6x8 |
23 |
7448 |
|||
| T23N | INGENIC/君正 |
QFN88 |
230 |
|||||
| NSI1312S-DSWVR | IC |
NOVOSENSE/纳芯微 |
25+ |
680 |
||||
| W664GG6RB-06 | IC |
WINBOND/华邦 |
20000 |
|||||
| CS48520S | IC |
CHIPANALOG/川土微 |
25+ |
2000 |
||||
| OMAPL138EZWTA3R | 单片机MCU |
TI/德州仪器 |
2522 |
125 |
||||
| GD25Q256EYIGR | 存储IC |
GD/兆易创新 |
WSON-8-EP(6x8) |
1500 |
||||
| AT32F415RBT7 | 32位MCU |
ARTERY/雅特力 |
LQFP-64(10x10) |
4800 |
||||
| W66DP2RQQAGJ | IC |
WINBOND/华邦 |
288 |
|||||
| HSEMTCY2D2B64GG | 存储IC |
海康 |
1000 |
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